John H. Booske

John H. Booske (S 82 – M 85 – SM 93 – F 07) received the Ph.D. degree in nuclear engineering from the University of Michigan, Ann Arbor, MI, USA, in 1985.

From 1985 to 1989, he was a Research Scientist with the University of Maryland, College Park, MD and since 1990, he has been a faculty member in the Department of Electrical and Computer Engineering, University of Wisconsin-Madison (UW), which he Chaired from 2009-2018. Currently he is Director of the Wisconsin Collaboratory for Enhanced Learning (, and is the Duane H. and Dorothy M. Bluemke Professor of Engineering and UW-Madison Vilas Distinguished Achievement Professor.

From 2001 to 2005, he served as Director of the UW Interdisciplinary Materials Science Program. His research interests include sources and applications of coherent electromagnetic radiation (RF to THz), plasmas, materials science of advanced cathodes, and metamaterials-based antennas.

His recent research activities include vacuum electronics, microfabrication of millimeter-wave and THz regime sources and components, high-power microwaves, advanced cathodes, physics of the interaction of THz radiation and materials, microwave-generated plasma discharges, electromagnetic metamaterials and biological applications of electric and electromagnetic fields.

Prof. Booske is a Fellow of the IEEE (2007) and the American Physical Society (2011). He received the University of Wisconsin Vilas Associate Award for research and the U.S. National Science Foundation Presidential Young Investigator Award. He has received many teaching awards, including the UW Chancellor’s Distinguished Teaching Award, the UW Teaching and Learning Innovation Award and the IEEE EAB Major Educational Innovation Award. He is a recipient of the IEEE Plasma Science and Applications Prize award (2018) and the IEEE John R. Pierce award for excellence in vacuum electronics (2020).

John R. Pierce Award for Excellence in Vacuum Electronics 2020

For innovative, wide-ranging contributions to vacuum electronics science and technology and for tirelessly fostering collaboration, education and new applications.